Application advantages of nanofiber electronic products

With the popularity and diversification of smartphones, tablets, wearable devices and other electronic products, the development of the electronic tape industry is growing at an accelerated rate.

The output of electronic tape products in China increased to 751 million square metres from 586 million square metres in 2016,and the demand increased to 1,065 million square metres from 885 million square metres in 2016.

The complexity and precision of the internal structure and appearance design of electronic products pose many challenges to the performance of electronic tape products. Electronic adhesive has become an important material for the assembly, fixing, protection and connection of electronic components. In addition to the most basic adhesive requirements, it should also meet the performance of seismic buffering, water resistance, sealing, removability, insulation, chemical corrosion resistance, temperature resistance and so on.

At present, the adhesive material used in electronic products is mainly PE foam adhesive. PE foam adhesive is PE foam material as the base material, double-sided adhesive, used for electronic products panel bonding fixing, electronic products internal parts bonding fixing and electronic equipment packaging. PE foam inside the micron size bubble structure, can effectively absorb and disperse the impact and vibration of the outside world. It is endowed with good seismic buffer performance, and has good water resistance, sealing, aging resistance, high temperature resistance, corrosion resistance, aging resistance, easy processing and other properties.

With the design of electronic products becoming thinner and thinner, traditional PE foam is achieved by compression treatment to achieve a lower thickness, but this operation has an impact on the structure of the bubble inside the foam:

Impact 1: PE foam adhesive after compression causes elastic loss, after being subjected to external force, PE foam adhesive can not quickly return to the original state, affecting the durability of electronic products;

Impact 2: When PE foam adhesive is pasted on a rough or curved surface, it will warp due to bubbles or uneven contact, affecting the paste effect. It is not suitable for curved surface design or folding electronic devices.

MBRT nanomembrane is a high-performance electrostatic spinning nanomaterial that can be used to glue electronic components, It has the characteristics of light weight, small size, good water resistance, strong impact resistance, good warping resistance, flexible customization, adhesion and sealing, and excellent thermal conductivity. MBRT nanomembrane is composed of hundreds of millions of overlapping nanofibers, and the fibers can slip, which makes the nanofilm adhesive have stronger performance advantages than the common PE foam adhesive on the market:

1. The product is soft and fits the complex structure of electronic components.

2. The package is tightly fitting and has excellent impact resistance;

3. Solve the problem of warping of electronic products package, the package is flat and not easy to break when subjected to external force stretching;

4. MBRT nano-film can be as low as 10um or so, the thickness can be customised, light weight, small size, reduce the weight and volume of the terminal electronic products, to meet the needs of modern electronic products precision.

5. More importantly, MBRT nanofiber materials have been mass-produced.

The MBRT waterproof and breathable membrane production line adopts self-developed key technologies and equipment, which is capable of achieving high-volume, large-width, low-cost, continuous, stable and high-quality production, which is of great significance for the commercial application of nanofibre materials.

Related production line links：https://www.nanofiberlabs.com/product/nanofibre-waterproof-and-breathable-membrane-production-line.html