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Low-reflection electromagnetic interference (EMI) shielding composites are critical for next-generation electronic devices. Recently, Professor Shao-Yun Guo's team at Sichuan University has achieved low-reflection EMI shielding and multiple thermal management functions by bilayered distribution of Ag and Fe3O4 in Electrospun TPU Films! The related research result is entitled ‘Bilayered Distribution of Ag and Fe3O4 in Electrospun TPU Films for Low-Reflection Electromagnetic Interference Shielding and Multiple Thermal Management Functionalities’ published in Industrial & Engineering Chemistry Research.
1. Double-layer EMI shielding composite films with thermal management performance were successfully prepared by electrospinning, in-situ growth and hot pressing methods.
2. Fe3O4 particles are distributed in the upper layer for electromagnetic wave absorption and photothermal conversion, while Ag particles are distributed in the lower layer for EMI shielding, heat conduction and electrothermal conversion.
3. The composite Nanofiber Membrane has remarkable EMI shielding effect (98.2 dB) and low reflection coefficient (0.64), and also has excellent thermal conductivity (6.49 W/(m-K)). The upper layer exhibits favourable photothermal conversion with a saturation temperature of 91.3°C (1 sun). The lower layer exhibits favourable electro-thermal conversion performance with a saturation temperature of 92.6°C (6 V).
4. This work presents a novel strategy for the development of low-reflection EMI-shielded composite Nanofiber Membrane that combines multiple thermal management functions.
Preparation of Composite Nanofiber Membrane with Optimal EMI Shielding Efficiency and Thermal Management Performance
Composite films with optimal electromagnetic interference shielding effect and thermal management performance were prepared by a combination of electrospinning, in situ growth and hot pressing. The upper layer distributes Fe3O4 particles for electromagnetic wave absorption and photothermal conversion, and the lower layer distributes Ag particles for electromagnetic interference shielding, heat conduction, and electrothermal conversion. This dual-layer design synergistically enhances the EMI shielding and thermal management functions in the composite film, making it a promising solution for microelectronic systems.
Is it possible to tailor the composite film to specific applications by adjusting the distribution of Ag and Fe3O4 particles
By controlling the position and concentration of these functional fillers in the bilayer structure, the performance and functionality of the composite Nanofiber Membrane can be customised to meet the requirements of different applications.
This design flexibility allows for optimisation of EMI shielding, thermal management and other performance aspects based on the specific needs of the electronic device or system using the composite Nanofiber Membrane.
Originallink: https://doi.org/10.1021/acs.iecr.3c03723