Controlled temperature auxiliary gas, object surface no condensation;
Removal of foreign particles at micro and nano levels;
Micro-nano particles dry ice, small damage to objects;
No waste water, waste liquid generated;
No additional drying process, low power consumption;
Suitable for complex shapes;
Dry ice particle diameter: 0.5-1000 microns adjustable;
Optional online detection, graphical cleaning and other functions.
Controlled temperature auxiliary gas, object surface no condensation.
Removal of foreign particles at micro and nano levels.
Micro-nano particles dry ice, small damage.
No waste water, waste liquid generated.
No additional drying process, low power consumption.
Suitable for complex shapes.
Dry ice particles diameter: 0.5 1000 microns is adjustable.
Optional online detection, graphical cleaning and other functions.
Class | No. | Cleaning method | Foreign body particle removal | Membrane layer removal | Damage to the object | Drying process | Environmental pollution | Problem |
Wet | 1 | Water | General | Worse | Genera | Need | Bad | Re-attachment of water membrane, metal element residues |
2 | Organic solvent | General | Better | Larger | Need | Large | Organic solvent then attached, solvent after treatment | |
Dry | 3 | Nano-dry ice | Fine | Easy | Lower | - | - | Small cleaning area |
4 | Ultrasonic wave | General | Difficult | General | - | - | Solid foreign bodies, fine particles difficult to remove | |
5 | Air | General | Difficult | General | - | - | Solid foreign bodies, fine particles difficult to remove | |
| 6 | Atmospheric plasma | Easy | Difficult | Larger | - | - | Poor cleaning ability |
| Model | Semiconductor cleaning machine WMGB01 |
| Outline dimension | 450×500×300 |
| Weight | 20Kg |
| Power supply | 220V 50Hz single phase |
| Power | 2kW |
CO2 injection system | |
| CO2 | Liquid state |
| CO2 pressure | ≥5.5MPa |
| Nozzle specification | 0.1mm~4mm |
| CO2 consumption | 50~200g/min |
CO2 constant temperature system | |
| Medium | - |
| Capacity | - |
Temperature regulation range | - |
CO2 pressurization system | |
Driving medium | - |
| Driving air pressure | - |
| Boost ratio | - |
Boost volume | - |
| CDA auxiliary system | |
| CDA gas | Compressed air/nitrogen |
| CDA pressure | 0.1~0.8MPa |
CDA temperature regulation | Optional |
| Project | Appearance | Hole cleaning effect (EDX test residue） | Holecleaning effect （Aluminum layer thickness, SEM detection of aluminum layer） | Effect |
Dry ice before cleaning | Surface whitening | Residue in hole | Aluminum layer 4.5um | —————— |
 |
|  | ||
After dry ice cleaning | Clean surface | No residue in the hole | Aluminum layer 4.3um | ①Ideal cleaning effect; ②No corrosion to aluminum layer; ③Binding force5.2N/cm. |
 |
|  | ||
After high-pressure water gun cleaning | Clean surface | Inside the hole are copper chips | Aluminum layer 4.5um | ①Ideal cleaning effect; ②Inside the hole are copper chips; ③Binding force 4.5N/cm. |
 |
|  |
| Project | Hole cleaning effect (EDX detection residue) | |||
Dry ice before cleaning | 1 | 2 | 3 | Elemental analysis |
 |  |  |  | |
| After dry ice cleaning | 1 | 2 | 3 | Elemental analysis |
 |  |  |  | |
After the high-pressure water gun cleaning | 1 | 2 | 3 | Elemental analysis （Include Cu） |
 |  |  |  | |
